Coupled electronic and power supply frames for use with borehole conduit connections

ABSTRACT

An apparatus for retaining electronic components in a downhole component coupling mechanism includes: a power supply frame including a first housing configured to retain a power supply therein and isolate the power supply from downhole fluids, the power supply frame configured to be disposed in and constrained axially by a coupling assembly of a first downhole component and a second downhole component; an electronic component disposed in a second housing in the coupling assembly, the electronic component located external to the power supply frame; and a connector configured to transmit electric power from the power supply to the electronic component to supply electrical power to the electronic component.

BACKGROUND

During subterranean drilling and completion operations, various powerand/or communication signals may be transmitted through pipe segments orother downhole components, e.g., via a “wired pipe” configuration. Suchconfigurations include electrical, optical or other conductors extendingalong the length of selected pipe segments. The conductors are operablyconnected between pipe segments by a variety of coupling configurations.

One such coupling configuration includes a threaded male-femaleconfiguration often referred to as a pin box connection. The pin boxconnection includes a male member, i.e., a “pin” that includes anexterior threaded portion, and a female member, i.e., a “box”, thatincludes an interior threaded portion and is configured to receive thepin in a threaded connection.

Signal repeaters have been used to enhance transmission of power andcommunications between components over a telemetry line or system. Suchrepeaters are provided to reduce signal loss during transmission of datafrom downhole components to the surface.

SUMMARY

An apparatus for retaining electronic components in a downhole componentcoupling mechanism includes: a power supply frame including a firsthousing configured to retain a power supply therein and isolate thepower supply from downhole fluids, the power supply frame configured tobe disposed in and constrained axially by a coupling assembly of a firstdownhole component and a second downhole component; an electroniccomponent disposed in a second housing in the coupling assembly, theelectronic component located external to the power supply frame; and aconnector configured to transmit electric power from the power supply tothe electronic component to supply electrical power to the electroniccomponent.

A method of coupling downhole components includes: disposing a powersupply in a first housing of a power supply frame, the power supplyframe configured to isolate the power supply from downhole fluids;disposing the power supply frame in a coupling assembly of a firstdownhole component and a second downhole component; electricallyconnecting the power supply to an electronic component disposed in asecond housing in the coupling assembly via an electrical connectordisposed at the power supply frame, the electronic component configuredto facilitate transmission of signals between the first downholecomponent and the second downhole component; and coupling the firstdownhole component to the second downhole component and constraining thepower supply frame by the coupling assembly, wherein coupling includescommunicatively connecting the first downhole component to the seconddownhole component via the electronic component and the power supplyframe.

BRIEF DESCRIPTION OF THE DRAWINGS

The following descriptions should not be considered limiting in any way.With reference to the accompanying drawings, like elements are numberedalike:

FIG. 1 depicts an embodiment of a conduit segment of a downhole system;

FIGS. 2A-2C (collectively referred to as FIG. 2) depict an exemplaryelectronic frame assembly disposed in a coupling assembly of a first andsecond downhole component;

FIG. 3 depicts an embodiment of an electronic frame housing variouselectronic components;

FIG. 4 depicts an embodiment of an electronic housing assembly includingan electronics frame and an external power supply;

FIG. 5 depicts an embodiment of an electronic housing assembly includingan electronics frame and a power supply frame;

FIG. 6 depicts an embodiment of an electronic housing assembly includingan electronics frame and a power supply frame;

FIG. 7 depicts an embodiment of an electronic housing assembly includingan electronics frame and a power supply frame;

FIG. 8 depicts an embodiment of an electronic housing assembly includingan electronics frame and a power supply frame disposed in a downholecomponent coupling assembly; and

FIG. 9 depicts a flow chart providing an exemplary method ofmanufacturing an electronic housing assembly, coupling segments of aborehole conduit and/or performing a downhole operation.

DETAILED DESCRIPTION

There is provided an electronic housing assembly for use with downholecomponents, such as downhole tools, drill pipes and subassemblies. Theassembly includes an electronics frame to house electronic componentssuch as repeater electronics within a pressure-sealed and mechanicallyrobust frame that can be mounted at, near or within a couplingconfiguration (e.g., the pin and/or box portion of a pin-box connector).The assembly also includes an external power supply configured to bedisposed at, near or within the coupling configuration. In oneembodiment, the external power supply is disposed in a separate frame orhousing that is electrically connected to the electronics housing. Inone embodiment, a power supply housing is disposed adjacent to theelectronics housing within a coupling configuration, e.g., a bore-backsection of a pin-box connection. The power supply may be connected tothe electronics frame via at least one suitable connection, such as acapacitive, inductive, resonant and/or galvanic connection.

Referring to FIG. 1, an exemplary embodiment of a portion of a welldrilling, logging, completion and/or production system 10 includes aconduit or string 12, such as a drillstring or production string, thatis configured to be disposed in a borehole for performing operationssuch as drilling the borehole, making measurements of properties of theborehole and/or the surrounding formation downhole, and facilitatinghydrocarbon production.

The string 12 includes at least one string component, such as a pipesegment 14, having a first end 16 and a second end 18. An inner bore orother conduit 20 extends along the length of each segment 14 to allowdrilling mud or other fluids to flow therethrough. A communicationconduit 22 is located within the segment 14 to provide protection forelectrical, optical or other conductors to be disposed along the segment14. Although the string component is described as a pipe segment, it isnot so limited. The string component may be any type of downholecomponent or carrier that includes a coupling mechanism for coupling thedownhole component to another component.

The term “carrier” as used herein means any device, device component,combination of devices, media and/or member that may be used to convey,house, support or otherwise facilitate the use of another device, devicecomponent, combination of devices, media and/or member. Exemplarynon-limiting carriers include wireline or logging-while-drilling tools,wire pipe, drill strings of the jointed pipe type and any combination orportion thereof. Other carrier examples include casing pipes, wirelines,wireline sondes, slickline sondes, drop shots, downhole subs and BHA's.

The segment 14 includes a coupling assembly having at least one of afirst coupling 24 and a second coupling 26. The first coupling 24includes a male coupling portion 28 having an exterior threaded section,and is referred to herein as a “pin” 24. The second coupling 26 includesa female coupling portion 30 having an interior threaded section, and isreferred to herein as a “box” 26.

The pin 24 and the box 26 are configured so that the pin 24 can bedisposed within the box 26 to affect a fixed connection therebetween toconnect the segment 14 with an adjacent segment 14 or other downholecomponent. In one embodiment, the exterior of the male coupling portion28 and the interior of the female coupling portion 30 are tapered alongthe length of the segment 14 to facilitate coupling. Although the pin 24and the box 26 are described has having threaded portions, the pin 24and the box 26 may be configured to be coupled using any suitablemechanism, such as bolts or screws or an interference fit.

FIG. 2 illustrates an embodiment of an electronic housing assembly 40 invarious stages of assembly with the coupling assembly. The housingassembly 40 includes a first frame 42 (referred to as an “electronicsframe”) configured to be disposed within the coupling assembly andconfigured to hold various electronic components therein. The housingassembly 40 also includes a second frame 44 (referred to as a “powersupply frame”) configured to hold one or more power supplies, such asbatteries. Embodiments of the frames 42 and 44 are described herein,although the frames are not so limited. A “frame” as described hereinrefers to any housing or structure capable of being disposed with thecoupling assembly and capable of retaining components and isolatingcomponents from fluid and other environmental conditions.

In the embodiment shown in FIG. 2, the electronics frame 42 and thepower supply frame 44 are pressure-sealed and mechanically robust framesconfigured to be disposed within a coupling assembly between downholecomponents, e.g., within a space formed within the pin 24 and/or the box26. In one embodiment, the electronics frame 42 includes electronicsconfigured to facilitate wired pipe telemetry or other communications,and the power supply frame 44 includes a power supply, such as abattery. The frame 42 and/or the frame 44 include components forproviding a connection between the power supply and the electronics. Theframes 42 and 44 are mechanically distinct and separate from thecoupling assembly and the downhole components, and are configured to besecured at least axially based on encapsulation of the frame by thecoupling assembly and/or the downhole components. Thus, the housingassembly 40 does not need to be directly sealed or adhered to theconnection/components, but rather can rely upon the already existingsealing engagement between the components (e.g., the box-pinconnection).

As demonstrated in FIG. 2, in some embodiments, the housing assembly 40is separate and removable from the coupling mechanism and is shaped orotherwise configured to sit within a portion of the coupling mechanismand held axially in place by the coupling mechanism without requiringany additional connection or securing features. In one embodiment, thecoupling mechanism, when assembled, also holds the power supply frame 44in physical and/or electrical contact with the electronics frame withoutrequiring any additional connection or securing features, such as screwsor bonds. FIG. 2A shows the housing assembly 40 prior to assembly. FIG.2B shows the housing assembly 40 disposed or mounted within an elongatedbox bore-back 46. The bore-back 46 typically includes a reduction ofinternal diameter behind the threaded portion of the box 26, and isgenerally provided to reduce stress concentrations during static anddynamic loading.

In the embodiment of FIG. 2, the electronics frame 42 and the powersupply frame 44 are separate structures that can be coupled or connectedprior to disposal in the coupling assembly, or connected or coupledduring disposal. In one example, the electronics frame 42 is connectedor joined to the power supply frame 44 via welding or another permanentjoining method, or is removably connected via, e.g., threads or bolts.In one embodiment, the assembled housing assembly 40 is inserted intothe bore-back as a single component. In another embodiment, the powersupply frame 44 is inserted into the bore-back 46 such that the powersupply frame 44 is electrically connected to a cable or other electricaltransmission element in the respective pipe segment. The electronicsframe 42 is then inserted into the bore-back 46 and electricallyconnected to the power supply frame 44.

In one embodiment, the housing assembly 40 is not adhered to orrotationally fixed within the bore-back 46, although the housingassembly 40 can be adhered or fixed if desired. FIG. 2C shows thehousing assembly 40 within a fully assembled coupling between downholecomponents (e.g., pipe segments 14). The housing assembly 40 (or atleast the outer diameter or surface of the assembly 40) is entirelyencapsulated within the string 12 and is held axially in place by, e.g.,a pin face 48 and a shoulder 50 formed by the transition between thebore-back 46 and the main inner bore 20 of the string segment 14. Theelectronics frame 42 and the power supply frame 44 are thus axiallysecured solely due to the threaded connection and are encapsulatedwithin the connection and tools.

The frames 42 and 44, which in this embodiment are of a generallycylindrical shape (although embodiments are not limited to a particularshape) define a fluid conduit 52, which may be in the form of an inneror central bore, that provides fluid connection between the bores 20 ofthe string segments 14. The fluid conduit 52, in one embodiment, is acylindrical central conduit having a diameter that is at leastsubstantially equal to the diameter of the bores 20, although theconduit 52 can have a smaller diameter or have any shape or diametersuitable to transmit fluid between the segments 14. The frames 42 and 44also include an outer surface (e.g., a cylindrical surface) that isconfigured to fit within the bore-back 54.

Although the power supply is described in FIG. 2 as being coupled toelectronic components disposed in a frame or other structure that isinsertable into the coupling assembly, it is not so limited. The powersupply may be disposed in any suitable manner such that the electroniccomponents are located external to the power supply frame 44 or otherstructure supporting or retaining the power supply. For example, thepower supply frame 44 is configured to electrically connect to andprovide power to electronic components installed in or integrated intoone or both pipe segments or the coupling mechanism (e.g., mounted on apin and/or box surface).

FIG. 3 illustrates an embodiment of an electronics frame 42. Theelectronics frame 42 is configured to support electronics for drillpipes, downhole tools and other downhole components. Exemplaryelectronics include repeater electronics of a signal transmission systemconfigured to transmit power and/or communications between downholecomponents. For example, the frame 42 includes recesses, chambers orother retaining structures to house repeater components (e.g.,electronics and sealing components) for transmitting signals betweencomponents. Such exemplary repeater components include controlelectronics 54 such as multi-chip modules (MCMs), and signal couplingelements 56 such as coupler rings, antennas, electrical contacts andinductive coupling elements. The coupling element may be of any suitabletype, such as an inductive coil, direct electrical contacts and anoptical connection ring. Other exemplary components include transmissioncomponents such as connectors 58, interfaces 60 and various sealingcomponents 62 such as glass seals and antenna seals. Embodiments of theelectronics frame are described further in U.S. application Ser. No.13/724,416, filed on Dec. 21, 2012, the contents of which areincorporated by reference herein in their entirety.

It is noted that the power supply frame 44 may have a similarconfiguration as that shown in FIG. 3. For example, the power supplyframe 44 may include a similar support structure, recesses or pocketsfor supporting batteries or other power supplies, channels forsupporting connectors or conductors, and/or coupling elements to providean electrical connection between the power supply frame 44 and theelectronics frame or a downhole component.

In one embodiment, the electronics frame 42 and/or the power supplyframe 44 includes two or more parts or frame elements made from a highstrength material (e.g. alloy steel or superalloy), i.e., a materialthat can withstand temperature, pressure, fluid and operationalconditions experienced downhole. The frame elements are joined togetherto encapsulate the electronic components and/or power supply and isolatethe electronic components and/or power supply from borehole fluids andother environmental conditions. As described herein, borehole fluids mayinclude various liquids, gases, mixtures or liquids and gases andflowable solids. Exemplary fluids include water, hydrocarbons, drillingfluids, stimulation fluids, air and other gases, foams, sealing fluidsand others.

In one embodiment, the frame elements are mechanically joined togetherby a permanent mechanical joining, such as a weld or an adhesive.Exemplary welding methods include laser or electron beam welding. Asdescribed herein, “permanently joined” is defined as being joined suchthat the frame elements are mechanically joined via a connection thatforms at least a fluid-tight seal between the elements without includinga feature (e.g., bolts) that provides a mechanism for disconnecting theelements.

FIG. 4 illustrates one embodiment of the housing assembly 40 includingthe electronics frame 42 electrically and mechanically connected to thepower supply frame 44. The electronics frame 42 and the power supplyframe 44 each include a first or main frame element and one or moresecond frame elements that are welded or otherwise permanently joined tothe main frame element. In this embodiment, the electronics frame 42includes a first frame element configured as a support structure or mainbody 64 that includes retaining structures for accommodating variouselectronic components. Exemplary retaining structures include one ormore cavities 66 to accommodate electronic components such as interfacesand processing chips, and bores or channels 68 to accommodate elongatedcomponents such as connectors, cables, wires, fluid conduits and opticalfibers (e.g., for direct/passive signal transmission and/or activesignal transmission). Sealing components such as glass or polymer seals70 may be included with the channels 68. In the embodiment of FIG. 4,the channels 68 are configured to retain wires or other conduits thatare electrically connected to the power supply frame 44 and the drillpipe (e.g., pin or box).

The main body 64 of the electronics frame 42 is joined to a second frameelement, which in this embodiment is configured as a sleeve 72 thatcovers and protects electronic components in, for example, the cavities66.

The power supply frame 44 includes a support structure or main body 74that includes one or more channels 76 configured to retain a wire orother conductor to electrically connect the electronics frame 42 to thepipe segment (e.g., pin or box). One or more retaining elements such asone or more pockets 78 are configured to retain a power supply such as abattery. The main body 74 is configured to electrically connect thepower supply to the electronics retained in cavity 66. In oneembodiment, the power supply and electronics are connected via thechannels 68 and 76.

In the embodiment of FIG. 4, the sleeve 72 is a single sleeve joined toboth main bodies 64 and 74. In another embodiment, separate sleeves orsecond frame elements are provided for the electronics frame 42 and thepower supply frame 44, or the power supply frame 44 does not include asecond frame element. In this embodiment, welds 80 and 82 join the mainbody 64 and/or the main body 74 to the sleeve 72. For example, as shownin FIG. 4, an end of the sleeve 72 is welded to an annular shoulder ofthe main body 64, an annular shoulder of the main body 74 and an outersurface of the frame 42 and/or 44.

The electronics frame 42 is connected or coupled to the power supplyframe 44, in this embodiment, via a permanent joining technique such asbonding or welding. For example, the frames 42 and 44 are welded via oneor more welds 84 that provide a fluid-tight seal between the electronicsframe 42 and the power supply frame 44. The mechanisms or features usedfor connecting or coupling the frames 42 and 44 are not limited to thosedescribed herein. For example, the frames 42 and 44 may be connected viaa removable connection, such as one or more bolts or screws. In anotherexample, the frames 42 and 44 are held in contact due to the couplingmechanism of the downhole components, such as the pin-box configurationof FIG. 2.

In one embodiment, the second frame element is configured as a portionof the box, pin or other coupling mechanism. For example, instead of thesecondary frame element being a sleeve, cover, inlay or other elementthat is welded to the main body 64 and/or the main body 74 prior toinsertion into the pin-box connector, the main body 64 and/or 74 may bewelded or joined to a surface in the pin or box. An exemplary surface isa surface of the box bore-back.

In one embodiment, one or more orientation mechanisms are included toensure that the electronics frame 42 is rotationally oriented relativeto the power supply frame 44 so that the proper electrical connection isachieved. For example, as shown in FIG. 4, the frames 42 and 44 includeaxial bores or channels to accommodate shear pins 86.

In addition to the mechanical connection described above, theelectronics frame 42 and the power supply frame 44 are electricallyconnected via a suitable electrical connection. In the embodiment shownin FIG. 4, the frames 42 and 44 (i.e., conductors disposed in thechannel 76 and the channel 68) are connected via galvanic coupling. Theconnection is not so limited, however, as the connection can be achievedvia one or more of capacitive, inductive, resonant or galvanic coupling.

FIG. 5 shows an embodiment of a coupling assembly 40 in which the frames42 are coupled via a sealed connector 88. The connector 88 in thisexample provides a galvanic coupling. The connector 88 may also includean antenna or coupler ring, which would eliminate the need forrotational orientation to provide an electrical connection. Theconnector may include other connection mechanisms, such as capacitors,or transmitters and/or receiver coils.

FIGS. 6 and 7 show embodiments having a connection mechanism thatincludes a sealed connector tube 90. In the embodiment shown in FIG. 6,the connector tube includes a cable segment 92 or other conductorsegment configured to connect to conductors disposed within the frames42 and 44. The conductor segment 92 connects to the frame conductors viafemale contacts 94, although any type of galvanic contact could be used.

FIG. 7 shows an embodiment in which the connector tube 90 is disposedaround the channel 76 in the power supply frame 44. The tube 90 extendsbeyond the end of the power supply frame 44 and is configured to couplewith an enlarged coupling portion 96 of the electronics frame 42. In oneembodiment, the tube 90 is incorporated into the electronics frame 42and is configured to be inserted into an enlarged channel portion in thepower supply frame 44. In one embodiment, both the frames 42 and 44include an enlarged portion so that the tube 90 can be inserted intoboth frames. The tube 90 may be joined to the frame 42 via welds 98 orother joining mechanisms. The tube 90 as shown in FIGS. 6 and 7 may alsobe used to orient the frames 42 and 44 relative to each other.

In one embodiment, the frame 42 and/or the frame 44 includes fixationelements configured to hold the housing assembly 44 in a fixed position,e.g., a fixed rotational position, relative to the pipe segment(s) 14.For example, grooves or recesses may be included in one of the housingassembly 44 and the pipe segment (e.g., the box bore-back interiorsurface) that are configured to engage corresponding protrusions in theother of the housing assembly 44 and the pipe segment. Other fixationelement embodiments may include bolts, screws and other forms of fitelements. Any type of fixation element or mechanism may be used,including interference fit configurations, gluing, welding and bonding.As discussed above, the tube 90 or other type of electrical connectionmay be used as a fixation element.

FIG. 8 shows an example of such fixation elements. One or more plugs orbolts 100 are configured to rotationally secure the power supply frame44 to a pipe segment 102. The frame 44 in this example is a cylindricalframe disposed in a box bore back of the pipe segment 102. Bolts 100 maybe separate components as shown and insertable into holes formed in thepipe segment and/or the power supply frame 44, but are not so limited.In some examples, the bolts 100 may be attached to or integral with thepower supply frame 44 such that the bolts can be inserted into holes ofthe pipe segment when the frame 44 is inserted into the bore back. Otherfixation elements include one or more plugs or bolts 104 that can engagethe frames 42 and 44 to prevent relative rotation and provideorientation.

In one embodiment, a length adjustment element is included to conformthe assembly 40 the bore back or other portion of the pipe segment. Forexample, the length adjustment element is a cylindrical element such asa gasket 106 having an axial length that results in a desired length ofthe housing assembly 40. The adjustment element may have a fixed lengthor may be adjustable to change the length of the assembly 40 as desired.

One embodiment of a method 110 of manufacturing an electronic housingassembly, coupling downhole components and/or performing a downholeoperation is shown in FIG. 9. The method 110 includes one or more stages111-114. In one embodiment, the method 100 includes the execution of allof stages 111-114 in the order described. However, certain stages may beomitted, stages may be added, or the order of the stages changed.

In the first stage 111, electronics are disposed or assembled in acoupling mechanism. The electronics may be attached or mounted directlyto the coupling mechanism or may be disposed in a retaining structuresuch as the electronics frame 42.

In the second stage 112, a power supply is disposed in a retainingstructure such as the power supply frame 44 and electrically connectedto the electronics. An exemplary power supply retaining structureincludes a main body having recesses or pockets to retain the powersupply (e.g., a battery), and the power supply retaining structure isassembled by welding or otherwise joining a sleeve or other protectivestructure to the main body to isolate the power supply.

In the third stage 113, a first downhole component is coupled to asecond downhole component. As described above, in one example, theelectronics frame 42 and/or the power supply frame 44 are inserted intothe box bore-back 46, and the pin and box are assembled to encapsulateand axially restrict the electronics frame 42 and/or the power supplyframe 44. In other embodiments, the power supply frame 44 is insertedinto the coupling assembly and electrically connected to electronicsincorporated into the coupling assembly and/or one or more downholecomponents.

The coupling assembly is assembled around the electronics frame 42and/or the power supply frame 44 to constrain the frame 42 and/or frame44 therein. The coupling assembly may hold the electronics frame 42 andthe power supply frame 42 in physical or mechanical contact, and mayalso hold the frames in electrical contact. For example, the pin end ofa first component is inserted into the box end of a second component,and the pin is rotated to engage the threaded portion of the box. Asshown in the example of FIG. 2, the power supply frame 44 is thusentirely constrained within the pin-box coupling and the connectedborehole string. It is noted that the electronics frame 42 and/or thepower supply frame 44 need not be rotated or angularly positioned (e.g.,when an antenna or coupler ring is used, and are not necessarilyrestricted in the angular direction.

In the fourth stage 114, the first and second downhole components (e.g.,segments 14) are lowered into a borehole. The segments 14 may be loweredinto the borehole during or after a drilling, completion, measurement orother downhole operation. Additional segments 14 may be connectedtogether via, e.g., respective pins 24 and boxes 26 including a frame 40to further lengthen the string and lower the string 12 into theborehole.

The apparatuses and methods described herein provide various advantagesover existing methods and devices. For example, the frames providehighly reliable housing and sealing of electronic and power supplycomponents under high mud pressure (e.g. 30000 psi) in an inner bore aswell as in the annulus and on the outer diameter of downhole equipment.

Connection between downhole components can be relatively easilyachieved, as the frame(s) can be easily mounted, axially fixed anddismounted within the bore-back or other portion of a coupling assembly.In addition, assembly of the frame(s) within the coupling assembly, insome embodiments, does not require angular positioning. Furthermore, thepower supply frame can be easily mounted within a coupling mechanism toprovide an easy exchangeable energy source.

In support of the teachings herein, various analyses and/or analyticalcomponents may be used, including digital and/or analog systems. Thesystem may have components such as a processor, storage media, memory,input, output, communications link (wired, wireless, pulsed mud, opticalor other), user interfaces, software programs, signal processors(digital or analog) and other such components (such as resistors,capacitors, inductors and others) to provide for operation and analysesof the apparatus and methods disclosed herein in any of several mannerswell-appreciated in the art. It is considered that these teachings maybe, but need not be, implemented in conjunction with a set of computerexecutable instructions stored on a computer readable medium, includingmemory (ROMs, RAMs), optical (CD-ROMs), or magnetic (disks, harddrives), or any other type that when executed causes a computer toimplement the method of the present invention. These instructions mayprovide for equipment operation, control, data collection and analysisand other functions deemed relevant by a system designer, owner, user orother such personnel, in addition to the functions described in thisdisclosure.

One skilled in the art will recognize that the various components ortechnologies may provide certain necessary or beneficial functionalityor features. Accordingly, these functions and features as may be neededin support of the appended claims and variations thereof, are recognizedas being inherently included as a part of the teachings herein and apart of the invention disclosed.

While the invention has been described with reference to exemplaryembodiments, it will be understood by those skilled in the art thatvarious changes may be made and equivalents may be substituted forelements thereof without departing from the scope of the invention. Inaddition, many modifications will be appreciated by those skilled in theart to adapt a particular instrument, situation or material to theteachings of the invention without departing from the essential scopethereof. Therefore, it is intended that the invention not be limited tothe particular embodiment disclosed as the best mode contemplated forcarrying out this invention, but that the invention will include allembodiments falling within the scope of the appended claims.

What is claimed is:
 1. An apparatus for retaining electronic componentsin a downhole component coupling mechanism, comprising: a power supplyframe including a first housing configured to retain a power supplytherein and isolate the power supply from downhole fluids, the powersupply frame configured to be disposed in a coupling assembly includinga first coupling portion of a first downhole component and a secondcoupling portion of a second downhole component, the first couplingportion configured to engage the second coupling portion to connect thefirst downhole component to the second downhole component, the powersupply frame being seprate from the first downhole component, the seconddownhole component and the coupling assembly, the power supply frameconfigured to be at least partially disposed in a space formed by atleast the second coupling portion and constrained axially by the firstcoupling portion without any additional securing features uponengagement of the first coupling portion with the second couplingportion; an electronic component disposed in a second housing in thecoupling assembly, the electronic component located external to thepower supply frame; and a connector configured to transmit electricpower from the power supply to the electronic component to supplyelectrical power to the electronic component.
 2. The apparatus of claim1, wherein the electronic component is configured to facilitatetransmission of signals between the first downhole component and thesecond downhole component.
 3. The apparatus of claim 1, wherein thesecond housing is incorporated in an electronics frame configured toretain the electronic component therein and isolate the electroniccomponent from downhole fluids, the electronics frame configured to bedisposed in the coupling assembly and constrained axially by the powersupply frame and the coupling assembly.
 4. The apparatus of claim 1,wherein the second housing is attached to the coupling assembly.
 5. Theapparatus of claim 1, wherein the power supply frame includes aretaining structure configured to retain the power supply, and aprotective structure configured to be disposed at the retainingstructure, the protective structure permanently joined to the retainingstructure to isolate the power supply from downhole fluids and form thepower supply frame.
 6. The apparatus of claim 1, further comprising afluid conduit formed by at least the power supply frame, the fluidconduit configured to provide fluid communication through the couplingassembly and between the first and second downhole component.
 7. Theapparatus of claim 1, wherein the coupling assembly includes a pinlocated at an end of the first downhole component and a box at an end ofthe second downhole component, and the power supply frame is configuredto be disposed in a bore-back region of the box and constrained axiallyby the pin and the box when the coupling mechanism is assembled.
 8. Theapparatus of claim 1, wherein the connector is a galvanic connector. 9.The apparatus of claim 8, wherein the connector is disposed in a sealedtube configured to connect a conductor in the power supply frame to theelectronic component.
 10. The apparatus of claim 1, wherein theconnector is selected from at least one of a capacitive connector, aninductive connector and a resonant connector.
 11. The apparatus of claim1, wherein the electronic component is disposed in an electronics frameseparate from the power supply frame, the electronics frame electricallyconnected to the power supply frame, the electronics frame and the powersupply frame held in contact by the first downhole component and thesecond downhole component when the coupling assembly is assembled.
 12. Amethod of coupling downhole components comprising: disposing a powersupply in a first housing of a power supply frame, the power supplyframe configured to isolate the power supply from downhole fluids;disposing the power supply frame and a second housing in a couplingassembly of a first downhole component and a second downhole componentthe coupling assembly including a first coupling portion of a firstdownhole component and a second coupling portion of a second downholecomponent, the power supply frame being separate from the first downholecomponent, the second downhole component and the coupling assembly,wherein disposing the power supply frame includes at least partiallyinserting the power supply frame into a space formed by at least thesecond coupling portion; electrically connecting the power supply to anelectronic component disposed in the coupling assembly via an electricalconnector disposed at the power supply frame, the electronic componentconfigured to facilitate transmission of signals between the firstdownhole component and the second downhole component; and coupling thefirst downhole component to the second downhole component andconstraining the power supply frame by the coupling assembly, whereincoupling includes engaging the first coupling portion with the secondcoupling portion, communicatively connecting the first downholecomponent to the second downhole component via the electronic componentand the power supply frame, and axially constraining at least the powersupply frame by first coupling portion without any additional securingfeatures.
 13. The method of claim 12, further comprising disposing thefirst downhole component and the second downhole component in a boreholein an earth formation and performing a downhole operation, the downholeoperation including advancing a borehole fluid between the firstdownhole component and the second downhole component through a fluidconduit formed by at the power supply frame.
 14. The method of claim 12,wherein the second housing is incorporated in an electronics frame, thesecond housing separate from the first housing, the electronics frameconfigured to isolate the electronic component from downhole fluids. 15.The method of claim 14, wherein disposing the power supply frameincludes electrically connecting the power supply frame to theelectronics frame and disposing both the electronics frame and the powersupply frame in the coupling assembly, wherein coupling the firstdownhole component to the second downhole component axially constrainsboth the electronics frame and the power supply frame.
 16. The method ofclaim 12, wherein disposing the power supply in the first housingincludes inserting the power supply into a recess formed in the firsthousing, and permanently joining a protective structure to the firsthousing to isolate the power supply from downhole fluids and form thepower supply frame.
 17. The method of claim 12, wherein the couplingassembly includes a pin located at an end of the first downholecomponent and a box at an end of the second downhole component.
 18. Themethod of claim 17, wherein the power supply frame is configured to bedisposed in a bore-back region of the box and constrained axially by thepin and the box when the coupling mechanism is assembled.
 19. The methodof claim 18, wherein the electrical connector is a galvanic connector.20. The method of claim 19, wherein the electrical connector is disposedin a sealed tube configured to connect a conductor in the power supplyframe to the electronic component.